Silicone Elastomers C
1 of 3 products in this brandPolymer Name: Silicone Elastomer
End Uses: Diaphragms, Electrical Interconnectors, Medical Devices, Microfluidic Devices, Optical Interconnectors, Seals
Features: Excellent Elastic Recovery, Excellent Flowability, Good Moldability, Good Penetration, Good Tear Strength, Good Thermal Stability, High Elongation, High Oxygen Permeability, High Performance, High Strength, Low Extractables, Low Hardness, Self-Sealing, Tear Resistance, Vibration Damping
Enhanced TDS
Identification
- Chemical Family
- Polymer Name
- Blend
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false
- Single Ingredient
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true
- Categories
Applications & Uses
- Processing & Fabrication
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Thoroughly mix Part A and Part B in a 100:1 ratio. Avoid introducing bubbles. For critical applications, de-air mix under vacuum. The pot-life is 24 hours at 25°C. Avoid entrapping air during transfer and casting. Cure at 100°C for 8 hours or at room temperature for 72 hours. Silicone Elastomers C can be self-bonded by exposure to oxygen plasma and pressing surfaces together in a dry atmosphere.
End Uses
- Plastics & Elastomers End Uses
Features
- Materials Features
Packaging & Availability
- Packaging Under
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Nitrogen
- Standard Packaging
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2-Part 100:1 Kit
- 202 g kit – contains 200 g part A (base), 2 g part B (cross-linker)
- 1.01 kg kit – contains 1000 g part A (base), 10 g part B (cross-linker)
Properties
- Physical Form
- Properties
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ExSil® 100 Part Viscosity (cSt) Silicone Elastomer Extractables (wt%)
Base (Part A) 12,000 - 14,000 Resin Reinforced Silicone 4.2 Activator (Part B) 800 - 1,000 Silicone - 100°C Strip 3.1 Activated Mix 12,000 - 14,000 ExSil® 100 0.2
Regulatory & Compliance
- Chemical Inventories
Technical Details & Test Data
- Technical Details and Test Data
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Stress Strain Curves of ExSil® 100 (blue) compared to resin reinforced silicone (black)
TGA thermograms of ExSil® 100 (blue) compared to resin reinforced silicone (black)
Heat Aging ExSil® 100 (blue) vs. Conventional resin reinforced silicone (black)
ExSil® 100 microfluidic device with filled channels showed no device failure during tortuous extension