Your ChemCo

Categories: Markets → Electrical & Electronics → Applications → Packaging & Assembly → Adhesives & Sealants

Markets → Consumer Goods → Applications → Appliances & Electronics

Markets → Electrical & Electronics → Applications → Devices & Assemblies → Displays

Markets → Adhesives & Sealants → Applications → Industrial & Assembly Adhesives → Electronics Adhesives

Technologies → CASE → Product Families → Resins & Binders → Epoxies

Technologies → Plastics → Product Families → Thermoset Resins → Epoxies

Markets → Electrical & Electronics → Applications → Parts & Components → Printed Circuit Boards (PCBs)

Technologies → Composite Materials → Product Families → Polymers & Resins → Thermoset Resins

Applications

CASE Ingredients Features: UV Resistance,

Improved Glass Transition Temperature,

Improved Productivity
Materials Features: Cost Effective,

Easy Film Formation,

High Glass Transition Temperature,

Improved Productivity,

Low Shrinkage,

Low Viscosity,

Low Water Absorption,

Odorless,

Sunlight Resistant,

Very Good Heat Resistance

Features

Advantage of polymer using MultiTech Resin as monomer

Low viscosity: Increasing filler contents, solvent-free and improvement of coating property and film-forming ability.
High heat resistance: Increasing Tg
High heat resistance: Improving productivity and cost reduction.
Very low viscosity - excellent for high filler content and for reactive diluent
Improving Tg by partial addition of MultiTech Resin

Improving Productivity
Improving Tg
Properties of Cured Resins by Thermal Cationic Initiator: Cure condition: Thermal acid generator SI-150L (Sanshin Chemistry Industry Co, Ltd.), Post cure 220~230°C.
Solubility of DE-102: Solubility of DE-102 to liquid epoxy (Dissolved by heating then left to stand at 25°C)

MultiTech Resin