MultiTech MultiFunctional L

Identification

Chemical Family

Bisphenol Epoxy Resins,

Epoxy & Epoxy Derivatives,

Bisphenol A Type Epoxy

Polymer Name

Epoxy Resins & Compounds

Blend

false

Single Ingredient

true

Categories

Markets → Electrical & Electronics → Applications → Packaging & Assembly → Adhesives & Sealants

Markets → Consumer Goods → Applications → Appliances & Electronics

Markets → Electrical & Electronics → Applications → Devices & Assemblies → Displays

Markets → Adhesives & Sealants → Applications → Industrial & Assembly Adhesives → Electronics Adhesives

Technologies → Plastics → Product Families → Thermoset Resins → Epoxies

Technologies → CASE → Product Families → Resins & Binders → Epoxies

Technologies → CASE → Product Families → Additives → Functional Additives

Technologies → Composite Materials → Product Families → Additives → Functional Additives

Markets → Adhesives & Sealants → Applications → Other Adhesives & Sealants Applications

Markets → Building & Construction → Applications → Other Building & Construction Applications

Markets → Electrical & Electronics → Applications → Devices & Assemblies → Other Devices & Assemblies

Markets → Electrical & Electronics → Applications → Packaging & Assembly → Other Packaging & Assembly Applications

Markets → Paints & Coatings → Applications → Other Paints & Coatings Applications

Markets → Electrical & Electronics → Applications → Packaging & Assembly → Potting Compounds

Markets → Electrical & Electronics → Applications → Parts & Components → Semiconductor Manufacturing

Technologies → Composite Materials → Product Families → Polymers & Resins → Thermoset Resins

Applications

Compatible Substrates & Surfaces

Ceramic,

Glass,

Metal,

Plastics,

Aluminum,

Steel,

Fibers & Fabrics,

Concrete

Cure Method

Radiation Cure

Applications & Uses

Usage & Application

• Photocure process (UV/LED)
• LED/OLED encapsulant
• LED reflector
• Adhesives for optical devices, electro-optic assemblies, and laser components.

End Uses

Coating End Applications

Radiation Curable Coating

Plastics & Elastomers End Uses

Semiconductor Applications

Features

CASE Ingredients Features

Excellent Adhesion,

Transparency,

Fast Cure,

Faster Cure Time,

Low Chlorine Content,

Radiation Curable

Materials Features

LED-curable,

UV Curable

Features & Benefits

Features

• Highly adhesive to metal, porcelain, concrete
• Excellent insulation property
• High heat resistance
• High chemical resistance
• High water resistance

Product Highlights

• Liquid type (easy to handle)
• Excellent Tranparency even after full-curing
• Adhesion
• High Photo cure rate
• Low chlorine level

Functions

CASE Ingredients Functions

Adhesion Promoter,

Coupling Agent,

Binder & Resin

Composite Materials Functions

Adhesion Promoter,

Resins, Binders & Matrix Materials

Plastics & Elastomers Functions

Resin

Function

Coupling Agent, Binder, Adhesion Promoter

Identification & Functionality

Molecular Structure

Packaging & Availability

Packaging Type

Drums,

Cans

Packaging Information

Steel drum with 200 kg net and metal can with 20 kg net

Properties

Physical Form

Liquid

Properties Formulation

			Value		Unit	Method
MultiTech MultiFunctional L			100	-	phr
Other company’s hydrogenated bisphenol A type epoxy			-	100
Anhydride curing agent (Methylhexahydrophthalic anhydride/Hexahydrophthalic anhydride = 70/30)			89	77	phr
Curing accelerator (Methyltributylphosphonium dimethylphosphate)			1	1	phr
Gel time @ 120 °C			30	36
Curing condition			100°C/3h + 130°C/3 h
Cured State Properties
Tg (tanδ)			135	-	°C	Dynamic Mechanical Analysis
Elastic modulus @ 30 °C			3.4	-	GPa	Dynamic Mechanical Analysis
Elastic modulus @ 220 °C			17	-	MPa	Dynamic Mechanical Analysis
Tg			136	110		Thermo Mechanical Analysis
Coefficient of Thermal Expansion (α1)			68	75	ppm	Thermo Mechanical Analysis
Coefficient of Thermal Expansion (α2)			172	186	ppm	Thermo Mechanical Analysis
Moisture absorption rate	72hr		0.8	0.9	%	85°C 85％RH
	168hr		0.83	0.92	%
Light resistance (Weathermeter, 0.4kw/m^2)	Yellowness index	0hr	1	1	-
		168hr	7	16	-
	Light transmittance at 360 nm	0hr	86	85	%
		168hr	53	35	%

Storage & Handling

Storage and Handling

Carefully read the SDS before using, handling, transporting, storing or disposing. MultiTech MultiFunctional L should be stored in tightly closed containers under exclusion of humidity at gentle temperatures. Avoid exposure to direct sunlight. Under these storage conditions the product has a minimum shelf life of three months from date of delivery.

Technical Details & Test Data

Adhesion Improvement Data of YX8000

YX8000 addition to CER improves adhesiveness to metal substrates.
*YX8000 is a former version of MultiTech MultiFunctional L with higher Cl impurity.

Share adhesive strength

Curing condition: 100°C x 3hr + 130°C x 3hr
Curing agent: Acid anhydride type
Share adhesive strength test: ISO4587 (JIS K 6850)

General Ways to Use Epoxy

• Epoxy resin forms 3D crosslinked network structure
• Abundant choices of Epoxy/Hardener combination

 

Izod Impact Strength Data

Photo Curability Data

MultiTech MultiFunctional L significantly decreases photo curing time to reach sufficient crosslinking reaction level compared to a conventional CER.

 

CER: Cycloaliphatic epoxy resin
Light source 200mW/cm², no filter, 25°C
Photo cationic catalyst CPI 100P San Apro Ltd.

Selection of Hardeners

Appropriate choice of Hardener for a desired curing temperature

Transparency Data of YX8000 Series

Transparency data of YX8000*

High transparency can be achieved by MultiTech MultiFunctional L.

*YX8000 is a former version of MultiTech MultiFunctional L with higher Cl impurity.

Curing condition: 100°C x 3hr + 130°C x 3hr
Curing agent: Acid anhydride type

Transparency of jER MultiTech MultiFunctional L

Typical Reactions with Representative Hardeners

Typical Reactions with Self Polymerization